Through-hole components are not designed to be busbar mounted. But I have the need to use "laminated" busbar because of some factors (among others):
- High current
- Small parasitic inductance
Power PCBs are also not available for small production, or even not manufactured at the thickness intended. Also they will present some problems to mount too.
Using modules or packages like SOT 227 is not an option now because of the cost, and the added terminals inductance of modules.
I have TO-247 IGBTs and I'm studding ways to mount then to the busbars.
Some of the options:
Soldering: As the busbar will conduct much more heat it seems to be difficult to make a good solder without overheating the package (at least with cost effective soldering methods).
Pressure: Making some pins in the busbar and pressure mount the pins. But with what method? Also it should be removable to allow for maintenance, even if the connector needs to be cut.
Terminals connectors like in this project:
(from http://kaizerpowerelectronics.dk/tesla-coils/kaizer-drsstc-i/)
This project uses the connectors only at some components.
The problems applying that to the TO-247 package transistors is the spacing between leads. The TO-247 has near 5mm pin to pin spacing, so the connector should be small if not to bend the terminal.
(Yes this will add a little parasitic inductance, but probably less than modules).
Any suggestion? Thanks.
